Thermosetting Solder Mask
NPR-5 is thermosetting solder mask (2-component type) which is consisted of epoxy resin.
It is suitable for FPC. NPR-5 has excellent flexibility which allows 180℃ bending and enable to maintain the flatness of FPC.
In addition, the exposure and developing process are not required then it contributes to cost down.
- Excellent flexibility which allows 180℃ bending and spring back is small.
- Exposure and developing process are not required then it contributes to cost down.
- Halogen free and RoHS compliant.
- Excellent flexibility.
- Almost no warpage occurs after curing.
|Item||Representative value||Test condition|
|Flexibility||No Crack||25um PI film, Angle 180deg., Pressure 50N|
|Pencil hardness||HB||JIS K 5600|
|Adhesion||Class 0||JIS K 5600|
|Warpage||< 1mm||25um PI film, Single side coat|
|Heat resistance to solder||> 1cycle||Pb free solder paste,
Reflow peak temp. 260deg.C, 30sec.
|Resistance to electroless Ni/Au Plating||PASS||Ni 3um / Au 0.08um thickness|
|Resistance to electrolytic Ni/Au plating||PASS||Ni 3um / Au 0.1um thickness|
|Resistance to acid||PASS||10% HCl aq., 25deg.C, 30min. Dipping|
|Resistance to alkaline||PASS||5% NaOH aq., 25deg.C, 30min. Dipping|
|Resistance to organic solvent||PASS||IPA, 25deg.C, 30min. Dipping|
|BR-HF No.13||Brown||Excellent flexibility, Small spring back||< 300ppm|
|LFBR||Brown||Long shelf life||< 300ppm|