NPR-5 Series

NPR-5 is thermosetting solder mask (2-component type) which is consisted of epoxy resin.
It is suitable for FPC. NPR-5 has excellent flexibility which allows 180℃ bending and enable to maintain the flatness of FPC.
In addition, the exposure and developing process are not required then it contributes to cost down.

Features

  • Excellent flexibility which allows 180℃ bending and spring back is small.
  • Exposure and developing process are not required then it contributes to cost down.
  • Halogen free and RoHS compliant.
  • Excellent flexibility.
  • Almost no warpage occurs after curing.

Properties

Item Representative value Test condition
Flexibility No Crack 25um PI film, Angle 180deg., Pressure 50N
Pencil hardness HB JIS K 5600
Adhesion Class 0 JIS K 5600
Warpage < 1mm 25um PI film, Single side coat
Heat resistance to solder > 1cycle Pb free solder paste,
Reflow peak temp. 260deg.C, 30sec.
Resistance to electroless Ni/Au Plating PASS Ni 3um / Au 0.08um thickness
Resistance to electrolytic Ni/Au plating PASS Ni 3um / Au 0.1um thickness
Resistance to acid PASS 10% HCl aq., 25deg.C, 30min. Dipping
Resistance to alkaline PASS 5% NaOH aq., 25deg.C, 30min. Dipping
Resistance to organic solvent PASS IPA, 25deg.C, 30min. Dipping

Products

Name Color Features Halogen Free
BR-HF No.13 Brown Excellent flexibility, Small spring back < 300ppm
LFBR Brown Long shelf life < 300ppm