NPR-90 Series
Highly Flexible Developed Photo Imageable Solder Mask
As NPR-90 series has low warpage, it's suitable for thinner FPC. And a reduction of cracking problem is expected during manufacturing because this series has excellent flexibility right after UV exposure.
Features
- Excellent flexibility and help reduce bending crack.
- Almost no warpage occurs after curing.
- Improved reflow resistance and solder heat resistance.
- High resolution for the fine pitch.
- Halogen free and RoHS compliant.
Properties
| Item | Representative value | Test condition |
|---|---|---|
| Photosensitivity | 9 〜 11 25 〜 31 |
21 Step tablet 41 Step tablet |
| Resolution | 45um / 45um | Line / Space, Thickness about 20um, Scattering light 500mJ/cm2 |
| Flexibility | > 5cycles > 7,000cycles |
25um PI film, Angle 180deg., Pressure 50N MIT folding endurance test R=2.0mm, 土 135deg. |
| Pencil hardness | 3H | JIS K 5600 |
| Adhesion | Class 0 | JIS K 5600 |
| Heat resistance to solder | > 2cycles | Pb free solder paste, Reflow peak temp. 260deg.C, 30sec. |
| HHBT | > 2,000hours | 85deg.C, 85%RH, DC60V, 100um Pitch (L/S=50um/50um) |
| HAST | > 200hours | 110deg.C, 85%RH, DC60V, 100um Pitch (L/S=50um/50um) |
| Resistance to electroless Ni/Au Plating | PASS | Ni 3um / Au 0.08um thickness |
| Resistance to electrolytic Ni/Au Plating | PASS | Ni 3um / Au 0.1um thickness |
| Resistance to acid | PASS | 10% HCl aq., 25deg.C, 30min. Dipping |
| Resistance to alkaline | PASS | 5% NaOH aq., 25deg.C, 30min. Dipping |
| Resistance to organic solvent | PASS | IPA, 25deg.C, 30min. Dipping |